Enhanced card flexibility and security for e-ID/smart card manufacturers
HID Global has unveiled an ultra-thin Polycarbonate ePrelaminate inlay for electronic ID (e-ID) cards that is more than 30 percent thinner than alternatives. The new offering is the first HID Global inlay to use its patented HID direct bonding platform technology, which is available for high frequency (HF) systems. NXP Semiconductors is HID Global’s first qualified partner supplying IC chips for this product.
“With this new ultra-thin inlay, we continue to extend the unique capabilities of our government solutions while offering smart card manufacturers around the world the ability to extend the range of products they can offer their customers,” said Rob Haslam, vice president of Government ID Solutions for HID Global.
In addition, the thinner inlay offers e-ID and smart card manufacturers more flexibility in card construction. The narrow dimensions of HID Global’s ultra-thin inlays provide manufacturers with room to add more security features on both sides of an e-ID card during construction, while still complying with international ISO thickness standards.
“This is an important step in our shared goal of offering smart card manufacturers the thinnest, most durable, reliable and flexible inlay solutions possible for today’s space-restricted high-frequency smart card solutions,” said Ulrich Huewels, senior vice president and general manager, Secure Identification Solutions, NXP Semiconductors.
